Processing of Low Temperature Co-Fired Ceramics

摘要

Low temperature co-fired ceramics(LTCC) are rapidly becoming the technology of choice for RE components and modules for portable wireless applications. LTCC technology has dcinonst rated that it can enable the high density integrated packages meeting the requirements for portable wireless. Commnercializalion of these modules requires the accurate prediction of dimensional changes during sintering in order to design passive integrated components(resistors, capacitors and inductors) in the LTCC module.