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Fracture Toughness of Martensitic NiTiHf High-Temperature Shape Memory Alloy

机译:马氏体NITIHF高温形状记忆合金的断裂韧性

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Fracture behavior of a martensitic Ni50:3Ti29:7Hf20 (at.%) high-temperature shape memory alloy (SMA) undermode-I nominally isothermal loading was examined. The material was characterized using di erential scanningcalorimetry to identify the transformation temperatures and uniaxial tensile testing to portray the stress{strainbehavior. Pre-cracked disk-shaped compact specimen was tested at room temperature and unstable crack growthwas observed. Fracture toughness was measured using the associated load versus crack-mouth opening displacementrecord. Digital image correlation was implemented to obtain the strain field on the surface and near thecrack-tip. Moreover, fracture surface was examined using scanning electron microscopy. The results provide keyinsights into the fracture properties of NiTiHf high-temperature SMAs.
机译:马氏体Ni50:3Ti29:7HF20(att.%)高温形状记忆合金(SMA)的断裂行为模式-I检测到名义上是等温荷载。使用DI界扫描表征材料的特征量热法识别转化温度和单轴拉伸试验,以描绘应力{菌株行为。在室温和不稳定的裂缝生长下测试预裂纹的盘状紧凑型样品被观测到。使用相关载荷与裂缝口开口位移测量断裂韧性记录。实现了数字图像相关性以获得表面上的应变场和附近裂缝尖。此外,使用扫描电子显微镜检查骨折表面。结果提供了关键洞察NITIHF高温SMA的断裂性能。

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