A Novel Structural Design of Heat-dissipation Method for High Brightness LED Lighting with Thermoelectric Chip Module

摘要

In various traditional technologies of solving the heat-dissipation problem for LED, all of these methods exhaust the waste heat into the environment and cause the more serious greenhouse effect. In this article, we present a new heat-dissipation method for high brightness 10W LED bulb using a novel structure of thermoelectric chip module. Evidence illustrates that graphite performs both the best heat-absorption material as well as the superior heat-dissipation material for LED thermoelectric chip module. Besides, the double-layered structure with graphite as heat-conduction material of LED thermoelectric module could create the most temperature-difference and thus conduct the highest output power. It implies that double-layered structure of LED thermoelectric chip module with graphite as heat-conduction material is the optimal structure for heat-dissipation of 10W LED bulb.