The Study on Subsurface Damage Depth and Morphology of Optical Material

摘要

The paper is mainly to research the subsurface damage depth and morphology on grinding and polishing substrates on optical materials, and analyze different subsurface damage morphologies caused by different processing technologies. The best etching solution is selected by experiments, grinding and polishing substrates are etched for proper time by divided stages. Use 120 × optical microscope and scanning electronic microscope to observe subsurface damage morphology and Taylor Hobson PGI1240 to measure the etching depth to obtain the subsurface damage depth.