Effects of Cu addition on microstructure and adhesion properties of Ti-Al-N nanocomposite films deposited by magnetron sputtering

摘要

Ti-Al-Cu-N films with different Cu contents were synthesized on 1Cr11Ni2W2MoV stainless steel by DC magnetron sputtering. The microstructure, composition, microhardness and adhesion properties of the films were characterized by SEM/EDS, XRD, microhardness and scratch tests. The results show that a reduction of the grain size and an increase of hardness in Ti-Al-N films doped withl.04at% Cu were detected. Further increase the Cu content in the Ti-Al-N film, the grain size increases and become irregular, and the microhardness decreases. The adhesion property of Ti-Al-Cu-N films increased slightly comparing with Ti-Al-N film. The effects of Cu contents on the microstructure and adhesion properties of the Ti-Al-N films were discussed.