Study on Chemical Plating and Shielding Effectiveness for Electromagnetic Shielding Fabric

摘要

For the purpose of investigating the influence of different process condition on alkali reduce rate and mass increase rate, the techniques of polyester fiber pretreatment, electroless copper plating, and electroless silver plating were carefully analyzed and compared. It was found that the best coursing condition was: 5.5 mol/L NaOH concentration, 65°C temperature, 30 minutes reaction time, 1:200 bath ratio. Under these conditions, the alkali reduction rate was 11.38%. As for copper plating liquid Cu~(2+) concentration of 0.08 mol/L, pH value 9.5, 80°C temperature, liquid silver plated Ag~+ concentration 0.02 mol/L, the coating weight gain rate was 52.1%. Microcosmic morphology on coating surface and surface resistance test show that the fabric was evenly coated with Cu, Ag, metal ions, which resulting in excellent electric conductivity and good electromagnetic shielding performance.