Improving the immunity of automotive ICs by controlling RF substrate coupling

摘要

This paper discusses RF substrate coupling in automotive integrated circuits. Analyses have been accomplished by measurements on wafer level. For this purpose test structures have been designed using a technology with partial dielectric isolation for automotive applications. The determining parameters to RF substrate coupling have been evaluated by measuring passive semiconductor structures. The findings are applied to an integrated circuit, which results in controlling RF substrate coupling and a circuit with a high degree of immunity against electromagnetic interferences (EMI).