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Effect of Tool Nose Radius on Nano-Machining Process by Molecular Dynamics Simulation

机译:分子动力学模拟刀尖半径对纳米加工过程的影响

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Today, there is a need to understand the micro mechanism of material removal to achieve a better roughness in ultra precision machining (UPM). The conventional finite element method becomes impossible to use because the target region and grids are very tiny. In addition, FEM cannot consider the micro property of the material such as atomic defect and dislocation. As an alternative, molecular dynamics (MD) simulation is significantly implemented in the field of nanomachining and nano-tribological problems to investigate deformation mechanism like work hardening, stick-slip phenomenon, frictional resistance and surface roughness [1]. One of the machining parameters than can affect nano-cutting deformation and the machined surface quality is tool nose radius [2]. In this paper molecular dynamics simulations of the nano-metric cutting on single-crystal copper were performed with the embedded atom method (EAM). To investigate the effect of tool nose radius, a comparison was done between a sharp tool with no edge radius and tools with a variety of edge radii. Tool forces, coefficient of friction, specific energy and nature of material removal with distribution of dislocations were simulated. Results show that in the nano-machining process, the tool nose radius cannot be ignored compared with the depth of cut and the edge of tool can change micro mechanism of chip formation. It appears that a large edge radius (relative to the depth of cut) of the tool used in nano-metric cutting, provides a high hydrostatic pressure. Thus, the trust force and frictional force of the tool is raised. In addition, increasing the tool edge radius and the density of generated dislocation in work-piece is scaled up that is comparable with TEM photographs [6].
机译:如今,需要了解材料去除的微观机制,以实现超精密加工(UPM)的更好粗糙度。传统的有限元方法变得不可能使用,因为目标区域和网格非常小。此外,有限元素不能考虑诸如原子缺陷和错位的材料的微量特性。作为替代的,分子动力学(MD)模拟在纳米机械线和纳米摩擦学问题领域中显着实现,以研究工作硬化,粘滑现象,摩擦阻力和表面粗糙度等变形机制[1]。一种加工参数之一比如何影响纳米切割变形,加工表面质量是刀尖半径[2]。在本文中,用嵌入原子法(EAM)进行单晶铜的纳米度量切割的分子动力学模拟。为了研究刀尖半径的效果,在一个锋利的工具之间进行了比较,没有边缘半径和具有各种边缘半径的工具。模拟刀具,摩擦系数,具有脱位分布的材料去除的材料去除系数。结果表明,在纳米加工过程中,与切割深度相比,刀尖半径不能忽略,刀具的边缘可以改变芯片形成的微机理。看来,在纳米度量切割中使用的工具的大边缘半径(相对于切割深度)提供高静水压力。因此,提出了工具的信任力和摩擦力。另外,增加工具边缘半径和工件中产生的位错密度被缩放,与TEM照片相当[6]。

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