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CPU thermal management of personal and notebook computer (Transient study)

机译:个人和笔记本电脑的CPU热管理(短暂研究)

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Heat generated by electronic devices and circuit must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as liquid cooling. Computer cooling is the process of removing heat from computer components. Because a computer system's components produce large amounts of heat during operation, this heat must be dissipated in order to keep these components within their safe operating temperatures. In addition to maintaining normative function, Components which produce heat and are susceptible to performance loss and damage include integrated circuits such as CPUs, chipset and graphics cards, along with hard drives (though excessive cooling of hard drives has been found to have negative effects). Overheated parts generally exhibit a shorter maximum life-span and may give sporadic problems resulting in system freezes or crashes. Both integral (manufacturing) and peripheral means (additional parts) are used to keep the heat of each component at a safe operational level. With regard to integral means, CPU and GPUs are designed entirely with energy efficiency, including heat dissipation, in mind, and with each advance CPUs/GPUs generally produce less heat (though this increased efficiency is always used to increase performance, producing similar heat levels as earlier models anyway). Cooling through peripheral means is mainly done using heat sinks to increase the surface area which dissipates heat, fans to speed up the exchange of air heated by the computer parts for cooler ambient air, and in some cases soft cooling. Comparisons between traditional methods of CPU cooling, and new fashions of cooling (like Heat pipes, and Thermoelectric cooling) have been performed. Moreover, Thermal affects on processor performance, has been studied. Effect of time on heat transfer and processor temperature enhancement has been studied.
机译:通过电子装置和电路产生的热量必须被耗散以提高可靠性和防止过早失效。用于散热的技术可以包括散热器和用于空气冷却风扇,和其它形式的计算机的冷却诸如液体冷却。计算机冷却是从计算机组件移除热的过程。由于计算机系统的组件在运行过程中产生大量的热量,这些热量必须以保持其安全的工作温度范围内这些组件进行散热。除了维护规范函数,它产生热量和易受性能的损失和损害组件包括集成电路如CPU,芯片组和图形卡,与硬盘驱动器一起(尽管过大的冷却硬盘已经发现有负影响) 。过热部件通常显示出较短的最大寿命并可以给予导致系统冻结或崩溃零星问题。两个积分(制造)和外围装置(附加零件)被用于保持各成分的热在安全操作水平。关于积分装置,CPU和GPU的与能量效率完全设计,包括散热,记,以及与每个预先的CPU / GPU的通常产生更少的热量(尽管这增加的效率总是用于提高性能,产生类似的热水平作为早期型号反正)。通过外围装置的冷却用散热片以增加散热表面积主要是做,风扇来加速由计算机零件较冷的环境空气中加热空气的交换,并且在一些情况下,软冷却。已经执行CPU冷却的传统的方法,和冷却的新时尚(如热管,和热电冷却)之间的比较。此外,热影响处理器的性能,进行了研究。时间上的传热和处理器温度增强效应进行了研究。

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