Recent investigations were carried of saturation and subcooled nucleate boiling of FC-72 and HFE-7100 dielectric liquids on porous graphite (PG) for potential applications to immersion cooling of high power computer chips. This talk will present the results of these investigations and those of the effect of surface inclination, from upward-facing to downward-facing, on the nucleate boiling heat transfer coefficient, and the critical heat flux. Natural convection results will also be presented of dielectric liquids on PG, important for cooling the chips in the standby mode when the surface heat flux is < 20 kW/m2. In addition, the results of CFD calculations comparing the performance of copper (Cu), PG and composite spreaders for removing the dissipated thermal power by computer chips will presented removing up to 1MW/m2 of dissipated heat by a 10 × 10 mm underlying chip.
展开▼
机译：最近的研究是在多孔石墨（PG）上的FC-72和HFE-7100电介质液体的饱和和过冷核沸腾，以潜在应用，以浸入高电脑芯片的冷却。该谈判将在核心沸腾的传热系数和临界热通量上呈现这些调查的结果和表面倾斜度的影响。在PG上还将呈现自然对流结果，这对于在表面热通量<20kW / m 2 时，对于在待机模式下冷却芯片的重要性。此外，CFD计算的结果比较铜（Cu），PG和复合涂布器的性能，用于通过计算机芯片去除耗散的热功率，将呈现最多1MW / m 2散热的散热一个10×10 mm的底层芯片。
展开▼
