GAS BARRIER AND ADEHESION PROPERTIES OF EVOH/GLASS COMPOSITE FOR GLASS SEALING

摘要

Over the years, the use of lead-containing glass sealants in the electronics industry has come under increasing environmental pressure. Recently, the toxicity of this material to humans has 1 also become an area of concern in Japan. Polymeric materials offer an environmentally benign alternative to the glass sealants. The advantageous non-toxic and low temperature processing characteristics of polymeric materials could lead the rapid replacement of lead-containing glass sealants, if they would fulfill the required properties such as gas barrier properties, weathering durability and adhesion. Materials which possess both sufficient barrier and adhesion properties should be chosen in order to achieve the required level of sealing properties. Furthermore, glass flake fillers should be dispersed in the polymeric matrix to ensure its sealing properties.