A Novel Intelligent Power Module Increases Efficiency Design and System Flexibility in Inverterized Drives Application

摘要

Small sized Intelligent Power Modules (IPM) is strongly increasing in inverterized consumer and industrial drive applications such as air-conditioner, washing machine as well as General Purpose Inverter (GPI). Compared to traditional discrete solution, small sized molded-module solution offers full electrical isolation between power devices and the heatsink. Additionally, such IPM module can significantly simplify the electrical system design and allow designer to shorten development cycle for an optimal low-cost products. This paper introduces a new approach for the realization of a novel IPM from Infineon, which was named as Control Integrated Power System (CIPOS(TM)). System efficiency and flexibility are greatly enhanced by using Direct Copper Bond (DCB) substrate instead of Insulated Metal Substrate (IMS) for power devices. A PCB board is adopted for gate driver IC and passive elements including bootstrap circuit. On the basis of these features brought by the novel concept, the thermal performance of the module and system efficiency is improved by comparing with some typical solution. An application example is also described to give a system level snapshot.