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Fabrication of InAs Photodiodes with reduced surface leakage current

机译:减小表面泄漏电流的INAS光电二极管的制造

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We report the findings of work undertaken to develop InAs photodiodes with low reverse leakage current, for detection of mid-wave infrared wavelengths up to 3.5pm. Good quality epitaxial growth of InAs and the lattice matched ternary AlAso i6Sbo 84 was developed using molecular beam epitaxy. A photodiode structure was designed, grown and characterized using an AlAso i6Sbo84 layer to block the diffusion of minority electrons. Further reductions in the reverse leakage current were achieved through studies of wet etching using a range of etchants. A sulphuric acid based etchant provided the lowest surface leakage current for a single etch step, however the surface leakage current was further reduces when a two steps etching process was employed, starting with a phosphoric acid based etchant and finishing off with a sulphuric acid based etchant. Surface profile analysis showed that higher etching rates were obtained in the direction parallel to the <100> direction. The atomic composition of the etched surface was investigated using Auger analysis. By etching a test pixel array, the potential for fabricating small pitch focal plane arrays by wet etching was evaluated.
机译:我们报告了开发INAS光电二极管具有低反向漏电流的工作的调查结果,用于检测中波红外波长高达3.5分。使用分子束外延开发了含有InAs和栅格匹配的三元匹配的三元匹配三元的良好外延生长。设计了光电二极管结构,使用Alaso I6SBO84层设计,生长和表征,以阻止少数群体电子的扩散。通过使用一系列蚀刻剂的湿法蚀刻来实现反向漏电流的进一步降低。基于硫酸的蚀刻剂,提供了用于单次蚀刻步骤的最低表面漏电流,但是当使用两个步骤蚀刻工艺时,表面漏电流进一步降低,从基于磷酸的蚀刻剂开始并用硫酸的蚀刻剂整理完成。表面轮廓分析表明,在平行于<100>方向的方向上获得较高的蚀刻速率。使用螺旋钻分析研究蚀刻表面的原子组成。通过蚀刻测试像素阵列,评估通过湿法蚀刻制造小间距焦平面阵列的电位。

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