TRANSIENT LIQUID PHASE BONDING OF A DIRECTIONALLY SOLIDIFIED NICKEL BASED SUPERALLOY

摘要

A microstructural study of transient liquid phase (TLP) bonded directionally solidified nickel based superalloy was performed. In agreement with conventional TLP bonding models, the time, tf, required to produce joints free of deleterious eutectic microconstituents in the alloy was found to reduce with increase in bonding temperature up to a certain temperature. However, above this temperature, a significant increase in the time tf was observed, due to decrease in the rate of isothermal solidification with increase in temperature. The anomalous observation is related to plausible effects of decreased solute solubility at higher bonding temperature.