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Environmental Exposure Dependence of Low Growth Rate Fatigue Crack Damage in Al-Cu-Li/Mg

机译:高生长率疲劳裂纹损伤的环境暴露依赖性在Al-Cu-Li / mg中的抑制

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The objective of this research is to establish the water vapor exposure dependence of fatigue crack surface morphology and facet crystallographic orientation using an SEM-based EBSD/stereological method applied to two planar slip prone Al-Cu-Mg/Li alloys stressed in the low crack growth rate regime. Crack surface morphology depends on environmental exposure (water vapor pressure/loading frequency); indicating multiple transitions in damage mechanism, crack growth rate, and facet orientation that are similar for each alloy. Moderate to high levels of exposure eliminate {111} facets, characteristic of slip band cracking in high vacuum and suggesting that environmental hydrogen does not promote this slip-based damage process. Varied facet crystallography, typical of crack growth at high environmental exposures, is explained by evolution of several facet orientations with increasing water vapor pressure/frequency ratio. A fraction of high index facets is produced by stressing in very low pressure water vapor, due to either a hard surface film or low-concentration H embrittlement. Further increases in exposure favor a large fraction of low index fatigue facets; {100} for Al-Cu-Mg and {100} plus {110} for Al-Cu-Li, as projected for H-enhanced decohesion. Additional high index cracking is produced at higher exposures for each alloy. For this regime, FIB/TEM analysis showed subgrains formed by fatigue and within ~200 nm of the crack wake for Al-Cu-Mg stressed in high pressure water vapor, perhaps contributing to fatigue damage and high index facet orientation.
机译:本研究的目的是利用施加到两个平面滑动的EBSD /立体学方法来建立疲劳裂纹表面形态和小相晶体取向的水蒸气曝光依赖性,其在低裂纹中应力胁迫的两个平面滑动易验型Al-Cu-Mg / Li合金增长率制度。裂纹表面形态取决于环境暴露(水蒸汽压力/装载频率);表示对每个合金相似的损伤机构,裂纹生长速率和刻面方向的多种过渡。中度至高水平的曝光消除{111}小平面,在高真空中开裂的滑槽裂缝的特征,并表明环境氢不会促进这种滑动的损伤过程。在高环境曝光中典型的裂缝生长的各种刻面晶体中的各个方面晶体学通过几个方面取向的演化来解释,随着水蒸气压力/频率比的增加。由于硬表面膜或低浓度H脆化,通过在非常低的压力水蒸气中强调,产生高指数小平面的一部分。进一步增加暴露有利于大部分低指数疲劳面;对于Al-Cu-Li的Al-Cu-Mg和{100}加{110}的{100},如H-Enhuped Decohonion投影。额外的高折射率裂解在每个合金的较高曝光处产生。对于该制度,FIB / TEM分析显示通过疲劳和〜200nm内的裂缝唤醒在高压水蒸气中施用的裂纹唤醒中,可能导致疲劳损坏和高指数面取向。

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