DYNAMIC THERMAL SIMULATION STUDY OF COPPER SLAG DILUTION UNDER DIRECT CURRENT FIELD

摘要

A new process of enrichment Cu in molten copper slag under electric field is presented in this article. The experiments were carried out in the laboratory on a kilogram scale. The mobility of copper slag was improved by the technique of carbon reduction. The effects of temperature, electric field strength and intermittent feeding speed were investigated on Cu migration. The results showed that the best experimental conditions were the temperature at 1523K, electric field strength was 1.5V-cm-l and feeding rates was 15 g-(10min)~(-1). The copper content of the slag decreased below 0.6wt%. The process was compared to the traditional electric furnace process of slag cleaning, there was reduced the energy consumption and heat loss, and also harmful gas emissions such as SO_2 and CO_2, accompanied by improved the efficiency of slag cleaning.