Reference Designs Leading PWB Fabricators to Future Technology

摘要

New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However, in the supply chain, the PWB fabricator is often the last link that will learn what is needed in terms of packaging density, hole size, line width and space, surface finish and dielectric material requirements. At the Wireless Terminal Business Unit of Texas Instruments in Denmark, new packaging technology combined with new chip functions are tested in reference designs. This takes place one to three years before the products enter the market in larger quantities. At the early product development only small number of PWBs have to be made to prove that the functionality of the hardware is working and to provide software engineers with "Reference Design" printed circuit boards that will enable software engineers to develop the software for new mobile phone applications. PWB fabricators that are involved in the early product development have to manufacture PWBs using new fabrication technologies and often new materials as well. The involvement in this advanced technology allows the PWB fabricators to have a one to two years time span to get the technologies and materials integrated in production for large quantities. The reality often demonstrates that proto series are made at companies that do not manufacture volume series at a later stage. Making fast turn around in small series block relatively high capacity in a volume factory and is often avoided unless volume orders are attached. Based on the past history, it will be explained how difficult it was to have the total supply chain lined up to meet the PWB fabrication technology to manufacturing PWBs for latest chip packages and to be able to source high quality PWBs at acceptable delivery time and cost.