The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component placement. The embedding of the passive components inside the PCB has already been used in the industry. To meet the requirement of the marketplace the new technologies like embedded actives Integrated Module Board (IMB) has been developed. With traditional technologies it has become more difficult to increase the packaging density. In the Integrated Module Board technology active components are embedded inside a printed circuit board (PCB) or other organic substrate. The IMB process combines PCB manufacturing, component packaging and component assembly into a single manufacturing process flow. The embedded passive technology and IMB technology enables high interconnection density with good reliability. The integration of components into the PCB level makes the manufacturing of the PCB challenging. In this paper an update of embedded passive technology will be presented together with an overview of IMB technology, its technological capability and electrical performance.
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