首页> 外文会议>IPC Electronic Circuits World Convention, Printed Circuits Expo, Apex, and the Designers Summit >Development of Cleanliness Specification for Single - Mode Connectors
【24h】

Development of Cleanliness Specification for Single - Mode Connectors

机译:单模连接器清洁规范的开发

获取原文
获取外文期刊封面目录资料

摘要

This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal Performance Project team. The project focused on the development of a cleanliness specification for single mode connectors. The influence of two grades of Arizona road dust on optical performance of single mode fibers is investigated. The researchers record insertion loss, return loss, and fiber optic microscope images for each connector pair before and after contamination. Interferometry data including radius of curvature, apex offset and fiber undercut are also recorded for each test and reference connector. The changes of insertion loss and return loss as a function of distance of the closest particle from the core are investigated. Results of mathematical modeling of contaminated fibers are correlated with experimental data. The results show that contamination particles can prevent direct physical contact creating an air gap between two end-faces. The area encompassed by a 25 μm diameter from the core is identified as critical. Particles located in this area, even if not directly on the core, result in an increase in insertion loss (a delta of 0.5 to 1.8 dB) and an increase in reflectance (a delta of 10 to 44 dB). Dust particles of 1-25 μm result in an air gap of up to 200 nm. The NEMI team is collaborating with the International Electrotechnical Committee (IEC), Telecommunications Industry Association (TIA) and IPC (Optoelectronic Assembly and Packaging Technology). Specifications will be jointly submitted to IEC SC86B Working Group 6 (interconnecting devices) for incorporation with IEC 61300-3-35, and to IPC as a draft of the IPC-8497-01 standard. In addition, the project will collaborate with TIA and IPC on the development of cleaning methods and contamination assessment for multi-level optical assemblies.
机译:本文总结了NEMI(国家电子制造计划)光纤信号性能项目团队执行的研究。该项目专注于开发单模连接器的清洁规范。研究了两种等级的亚利桑那路粉尘对单模纤维光学性能的影响。研究人员记录污染前后每个连接器对的插入损耗,返回损耗和光纤显微镜图像。每个测试和参考连接器还记录包括曲率半径,顶点偏移和光纤底切的干涉测量数据。研究了插入损耗和返回损耗的变化作为来自核心最近粒子的距离的函数。污染纤维的数学建模结果与实验数据相关。结果表明,污染颗粒可以防止直接物理接触产生两个端面之间的气隙。从核心的25μm直径包括25μm的区域被识别为关键。位于该区域的颗粒,即使不是直接在核心上,导致插入损耗(δ为0.5至1.8dB的δ),反射率增加(10至44dB的δ)。 1-25μm的灰尘颗粒导致空气隙高达200nm。 NEMI团队与国际电工委员会(IEC),电信行业协会(TIA)和IPC(光电装配和包装技术)合作。规范将共同提交给IEC SC86B工作组6(互连设备),以与IEC 61300-3-35合并,并作为IPC-8497-01标准的草案。此外,该项目还将与TIA和IPC合作开发用于多级光学组件的清洁方法和污染评估。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号