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Development of a Silicon Microneedle with Three-Dimensional Sharp Tip by Electrochemical Etching

机译:通过电化学蚀刻开发三维尖锐尖的硅片微针

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Aiming at the use in low-invasive medical treatments, this paper reports a fabrication of silicon microneedle with three-dimensional sharp tip. The authors have already confirmed by both finite element method (FEM) simulation and experiment that the stress concentration becomes more severe as the needle's tip becomes sharper, which makes the necessary force for inserting the needle lower. Following this, the electrochemical etching technique using hydrofluoric acid (HF) solution is employed for sharpening the tip of a pillar, which is diced from a silicon wafer.
机译:针对低侵入性医疗治疗的使用,本文报告了具有三维锋利尖端的硅片的制造。作者已经通过有限元方法(FEM)模拟和实验证实,因为针的尖端变得更清晰,应力浓度变得更加严重,这使得用于将针头插入下部的必要力。在此之后,采用氢氟酸(HF)溶液的电化学蚀刻技术用于锐化从硅晶片切割的柱的尖端。

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