One of the main problems encountered in rack plating is ensuring plating uniformity over the entire rack. Traditionally, this is solved in several expensive and time consuming trial and error steps by changing the rack design, masking, fixtures etc. Using Elsyca PlatingMaster, a fully CAD (SolidWorks) integrated simulation software, this trial and error process can be reduced significantly. The software allows calculating the current density and deposit thickness distribution in arbitrary shaped three dimensional electrochemical plating configurations. As a case study, the optimization of a rack plating process for selective deposition of nickel on complex parts will be presented.
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