首页> 外文会议>Conference on Hardness Measurements Theory and Application in Laboratories and Industries >DIRECT MEASUREMENT OF RESIDUAL CONTACT AREA AND VOLUME DURING THE NANOINDENTATION OF COATED MATERIALS AS AN ALTERNATIVE METHOD OF CALCULATING HARDNESS
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DIRECT MEASUREMENT OF RESIDUAL CONTACT AREA AND VOLUME DURING THE NANOINDENTATION OF COATED MATERIALS AS AN ALTERNATIVE METHOD OF CALCULATING HARDNESS

机译:在涂层材料纳米内的纳米内的剩余接触面积和体积的直接测量作为计算硬度的替代方法

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The mechanical properties of thin films can be measured by a variety of different techniques, with nanoindentation being one of the most recent developments in this growing field. By using a depthsensing indentation method it is possible to obtain quantitative values for the hardness and modulus, and thus gain better insight into the response of a material to controlled deformation at such small scales. However, previous work [1] has shown that the effects of pile-up, particularly in soft films deposited on hard substrates, can produce significant overestimation of the hardness and modulus due to an underestimation of the true contact area by common nanoindentation analysis procedures. By measuring the topography of the residual indent using Scanning Force Microscopy (SFM) and combining this information with the indentation data, it is possible to gain a fuller understanding of the indentation method and its effects on the material being tested. In addition, the true contact area can be directly measured from the SFM images and subsequently used to recalculate the hardness of the material more accurately. Moreover, the SFM allows the plastic volume of indentation to be measured, from which hardness can also be calculated in terms of plastic work. Experimental results are presented for two types of thin film deposited on hard substrates where SFM analysis of indentations at varying depths gives significant additional information concerning the true response of the system to instrumented indentation at a nanometric scale. Pile-up effects can be precisely monitored as a function of depth and correlated to hardness variations encountered across the coating/substrate interface.
机译:薄膜的机械性能可以通过各种不同的技术来测量,纳米凸缘是该生长领域中最新的最新发展之一。通过使用深度沉迷的凹口方法,可以获得硬度和模量的定量值,因此可以更好地深入了解在这种小尺度下控制变形的材料以控制变形的响应。然而,先前的工作[1]表明,堆积的影响,特别是在沉积在硬质基材上的软膜中,由于常见的纳米狭窄分析程序低估了真实接触面积,可能会产生显着高估硬度和模量。通过使用扫描力显微镜(SFM)测量残余缩进的形貌并将这些信息与压痕数据组合,可以更充分了解压痕方法及其对所测试材料的影响。另外,真正的接触区域可以直接从SFM图像测量,然后用于更准确地重新计算材料的硬度。此外,SFM允许测量压痕的塑料体积,从中可以根据塑料工作计算硬度。沉积在硬质基板上的两种类型的薄膜提出了实验结果,其中变化深度的凹口SFM分析提供了关于系统以纳米级的仪表压痕的真实响应的重要信息。可以精确地监测堆积效果作为深度的函数,并与涂层/衬底界面遇到​​的硬度变化相关。

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