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A Hierarchical Three-Way Interconnect Architecture for Hexagonal Processors

机译:用于六边形处理器的分层三向互连架构

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The problem of interconnect architecture arises when an array of processors needs to be integrated on one chip. With the deep sub-micron technology, devices become cheap while wires are expensive. On the other hand, high performance systems require the shortest communication routes among the processors. Non-blocking hierarchical interconnect architectures have been found to be a feasible solution. First, they can be expanded recursively and so can be applied in large-scale arrays. Second, if well designed, they have the best trade-off between the cost of wire resources and the communication performance. In this paper, a new type of non-blocking hierarchical three-way interconnect architecture, Y tree architecture, is put forward. We find that the arrays of hexagonal cells also have the property of hierarchical expansion, and we put an algorithm to build up a Y tree. We compare the Y architecture with an X hierarchical non-blocking architecture.
机译:当需要集成在一个芯片上时,互连架构的问题会出现。随着深层亚微米技术,电线昂贵的设备变得便宜。另一方面,高性能系统需要处理器之间最短的通信路线。已发现非阻塞分层互连架构是可行的解决方案。首先,它们可以递归地扩展,因此可以在大型阵列中应用。其次,如果设计良好,它们在电线资源和通信性能的成本之间具有最佳权衡。在本文中,提出了一种新型的非阻塞分层三向互连架构,Y树架构。我们发现六边形细胞的数组也具有分层扩展的属性,我们将算法建立y树。我们将y架构与x分层非阻塞架构进行比较。

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