首页> 外文会议>The Annual Meeting of The American Ceramic Society >DEVELOPMENT OF A PRESSURELESS SINTERED SILICON CARBIDE MONOLITH AND SPECIAL-SHAPED SILICON CARBIDE WHISKER REINFORCED SILICON CARBIDE MATRIX COMPOSITE FOR LIGHTWEIGHT ARMOR APPLICATION
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DEVELOPMENT OF A PRESSURELESS SINTERED SILICON CARBIDE MONOLITH AND SPECIAL-SHAPED SILICON CARBIDE WHISKER REINFORCED SILICON CARBIDE MATRIX COMPOSITE FOR LIGHTWEIGHT ARMOR APPLICATION

机译:开发无压烧结碳化硅碳化硅和特殊形状的碳化硅晶须增强碳化硅矩阵复合材料,用于轻型装甲应用

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Thick tiles were fabricated to address higher ballistic threats in a continuing effort to develop a pressureless sintered a-silicon carbide ceramic for lightweight armor applications. Tiles with a thickness of 1.9 cm and 2.8 cm were pressed and sintered from a spray-dried SiC powder and evaluated for density and mechanical properties. These thick tiles exhibited a gradient in density and mechanical properties at the center of the tile with larger gradients present in the 2.8 cm thick tile. The Modulus of Rupture ranged from a low of approximately 300 MPa to a maximum of 500 MPa. It is concluded that adjustments to green part fabrication methods and/or to the sintering schedule are required to eliminate gradients in density and mechanical properties. Additionally, composites utilizing shape-modified, silicon carbide ceramic whiskers are investigated with the goal of increasing the toughness of an otherwise brittle silicon carbide ceramic. The ceramic reinforcement whiskers are heat treated at high temperature in an inert atmosphere to produce rounded ends (bone-shaped whiskers) via atomic transport. The whisker-reinforced composite exhibited reduced sintered density and exaggerated grain growth. Physical/mechanical properties, photomicrographs and ballistic test results are reported and compared to commercial, armor-grade silicon carbide.
机译:厚厚的瓷砖被制造成解决更高的弹道威胁,在继续努力开发一种用于轻质装甲应用的无压烧结的碳化碳陶瓷。厚度为1.9cm和2.8cm的瓷砖从喷雾干燥的SiC粉末烧结并评估密度和机械性能。这些厚瓷砖在瓷砖中心的密度和机械性能下表现出梯度,具有更大的梯度厚的瓷砖。破裂模量从大约300MPa的低程度范围为最多500MPa。得出结论,需要调整绿色部分制造方法和/或烧结时间表,以消除密度和机械性能的梯度。另外,采用形状改性的碳化硅陶瓷晶须的复合材料,目的是提高诸如脆性碳化硅陶瓷的韧性的目的。陶瓷加强晶须在惰性气氛中在高温下进行热处理,以通过原子输送产生圆形末端(骨形晶须)。晶须增强复合材料表现出烧结密度降低和夸张的晶粒生长。报告了物理/机械性能,显微照片和弹道测试结果,并与商业装甲级碳化硅相比。

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