Copper films annealed at 873 K with the thickness of 100 and 30 mu m were fatigued and the crystal orientation at the notch root from which the fatigue crack was initiated was examined using EBSD (Electron Back-scatter Diffraction) system before and after the fatigue testing. Using the film with the thickness of 100 mu m, the two types of specimen that rolling direction was parallel and perpendicular to loading direction were prepared and the effects of rolling texture on the fatigue properties and the change of crystal orientation were discussed. As a result, there was a difference between the two types of specimen in crack propagation behavior and the scattering of the crystal orientation in the inverse pole figures was larger in the film loaded in parallel with the rolling direction than in transverse direction. As an effect of the film thickness, the cracks initiated and propagated faster in the film with the thickness of 30 mu m than 100 mu m, and the scattering of the crystal orientation in the inverse pole figures was larger in the thickness of 30 mu m than that 100 mu m.
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机译：在厚度为100和30μm的873k下退火的铜膜酸化，在疲劳试验之前和之后使用EBSD（电子背散射衍射衍射）系统检查凹口根部的晶体取向。使用厚度为100μm的薄膜，制备了轧制方向平行且垂直于装载方向的两种样品，并讨论了滚动质地对疲劳性能的影响和晶体取向的变化。结果，在裂缝传播行为中的两种类型的样品之间存在差异，并且在与横向上的滚动方向上平行地加载的膜中晶体取向的散射越大。作为膜厚度的效果，在厚度为30μmm m的薄膜中引发和传播裂缝，横极度数字中的晶体取向的散射在30 mu m的厚度较大比那100亩。
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