Laser-induced gold deposition for thin-film circuit repair

摘要

Laser chemical vapor deposition (LCVD) of gold has been used to repair 'open' defect on high-end multi-chip packaging modules. The ability to repair metallurgical features of less than 25 $mu@m width was readily accomplished and electrical resistances are comparable to resistances of unrepaired nets of identical geometry. The reliability of LCVD repairs was monitored after thermal processing, T&H and electrical stressing. The ability to repair 'open' defects in the thin-film redistribution (TFR) layer of the module has facilitated testing of designs early in the development process.