首页> 外文会议>IEEE International Symposium on Design and Diagnostics of Electronic Circuits amp;amp;amp;amp;amp;amp; Systems >Radiation- and Temperature-Induced Fault Modeling and Simulation in BiCMOS LSI’s Components using RAD-THERM TCAD Subsystem
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Radiation- and Temperature-Induced Fault Modeling and Simulation in BiCMOS LSI’s Components using RAD-THERM TCAD Subsystem

机译:使用Rad-Therm TCAD子系统的BICMOS LSI组件中的辐射和温度诱导的故障建模和仿真

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A special RAD-THERM version of TCAD subsystem based on Sentaurus Synopsys platform taking into account different types of irradiation (gamma-rays, neutrons, electrons, protons, single events) and external/internal heating effects was developed and validated to forecast the results of natural experiments, and help the designer on with reliability guarantee. The radiation- and temperature-induced faults were modeled and simulated for Si/SiGe BJTs/HBTs and bulk/SOI MOSFETs as BiCMOS LSI's components. The causes of device parameter degradation were discussed.
机译:基于Sentaurus Synopsys平台的TCAD子系统的特殊Rad-Therm版本考虑了不同类型的照射(伽马射线,中子,电子,质子,单一事件)和外部/内部加热效果,并验证以预测结果自然实验,帮助设计师进行可靠性保证。辐射和温度诱导的故障为Si / SiGe BJT / HBT和批量/ SOI MOSFET为BICMOS LSI的组件进行建模和模拟。讨论了设备参数劣化的原因。

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