Active Heat Sink for High-Power Laser Diodes

摘要

We introduced an innovative AHS suitable for thermal management of HPLD. Initial evaluation indicates that AHS has a strong potential for cooling of current and future generations of HPLD. In particular, the AHS appears very suitable for directly interfacing HPLD bars to primary system coolant and, potentially, to an air-cooled HEX. These applications would eliminate a dedicated liquid coolant loop for thermal management of HPLD and greatly simplify the system. The AHS is robust, requires very low electric power to operate, and is conducive to high-volume production.