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CHARACTERIZATION OF CERAMIC POWDERS DURING COMPACTION USING ELECTRICAL MEASUREMENTS

机译:使用电测量压实过程中陶瓷粉末的表征

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In this study we evaluated the electrical response of ceramic compacts during dry pressing as a function of applied pressure. Semiconductive SiC powders were used for the experiments. In order to determine the influence of porosity in the ceramic powder compacts, a custom made die with an insulating outer sleeve was used to carry out dc and ac measurements. Measurements were performed as a function of loading and unloading compaction pressure. Dc measurements can only detect the combined response from the powders and the porosity. However, from the impedance spectroscopy data, two semicircles were observed in the complex impedance plot that allow separation of the two processes. One of these semicircles represents the bulk material property, while the other is likely due to the void space and interfaces. An estimate of the volume porosity at the different stages of compaction is provided.
机译:在该研究中,我们评估了在干压期间作为施加压力的函数的陶瓷块的电响应。半导体SiC粉末用于实验。为了确定陶瓷粉末压块中孔隙率的影响,使用具有绝缘外套套筒的定制模具来进行DC和AC测量。作为装载和卸载压力的函数进行测量。 DC测量只能检测粉末和孔隙率的组合响应。然而,从阻抗光谱数据,在允许分离两个过程的复杂阻抗图中观察到两个半圆形。这些半圆之一代表散装材料特性,而另一个是由于空隙空间和接口可能导致的。提供了对压实阶段的体积孔隙率的估计。

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