首页> 外文会议>International Conference on Precision Engineering and Micro/Nano Technology in Asia >Forecasting of Surface Roughness and Cutting Force in Single Point Diamond Turning for KDP Crystal
【24h】

Forecasting of Surface Roughness and Cutting Force in Single Point Diamond Turning for KDP Crystal

机译:KDP晶体单点钻石表面粗糙度与切削力的预测

获取原文

摘要

The method of single point diamond turning is used to machine KDP crystal. A regression analysis is adopted to construct a prediction model for surface roughness and cutting force, which realizes the purposes of pre-machining design, prediction and control of surface roughness and cutting force. The prediction model is utilized to analyze the influences of feed, cutting speed and depth of cut on the surface roughness and cutting force. And the optimal cutting parameters of KDP crystal on such condition are acquired by optimum design. The optimum estimated values of surface roughness and cutting force are 7.369nm and 0.15N, respectively. Using the optimal cutting parameters, the surface roughness Ra, 7.927nm, and cutting force, 0.19N, are obatained.
机译:单点金刚石转动的方法用于机器KDP晶体。采用回归分析来构建表面粗糙度和切割力的预测模型,这实现了预加工设计,预测和控制表面粗糙度和切割力的目的。预测模型用于分析饲料,切割速度和切割深度对表面粗糙度和切割力的影响。并且通过最佳设计获取KDP晶体对这种情况的最佳切削参数。表面粗糙度和切割力的最佳估计值分别为7.369nm和0.15n。使用最佳切削参数,表面粗糙度Ra,7.927nm和切割力,0.19n,静置。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号