A novel approach for LTCC packaging using a PBG structure for shielding and package mode suppression

摘要

A packaging solution for multifunctional modules up to an operating frequency of 50 GHz based on Low Temperature Cofired Ceramics (LTCC) is presented in this paper. A Ball Grid Array (BGA) as well as a Land Grid Array (LGA) transition from Printed Circuit Board (PCB) into a surface mounted module are proposed. They use a Photonic Bandgap (PBG) structure to suppress the excitation of parasitic modes e.g. by the SMT interconnect. This approach provides process tolerant transitions as well as it allows the integration of wave guide structures in buried layers. This measure provides a greater flexibility in the design of microwave circuits and a major potential for miniaturisation of microwave subsystems.