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Vacuum Diffusion Bonding of Tunable Disc - A Component Of LINAC Accelerator

机译:可调谐圆盘的真空扩散键合 - LinaC加速器的组件

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The solid state bonding technique has been used to manufacture a tunable disc made of OFHC-Cu and austenitic stainless steel (AISI304). Joining of these materials have been carried out using Ni as an interlayer. In addition few specimens have also been bonded without Ni interlayer. Diffusion bonding experiments have been performed at temperature range from 750 to 900°C for times up to 60 min and at a pressure from 10 to 20 MPa. Taking into account of the results of mechanical testing and microstructal observation, for a sound bond, the optimum bonding conditions were obtained at temperature 850°C for 60 min at 10 MPa. Based on these studies a flow chart is made for the fabrication of the tunable disc.
机译:固态粘合技术已用于制造由OFHC-Cu和奥氏体不锈钢制成的可调谐盘(AISI304)。使用Ni作为中间层进行这些材料的连接。此外,在没有Ni中间层的情况下也粘合了很少的标本。扩散键合实验已经在750至900℃的温度范围内进行,速度高达60分钟,并且在10至20MPa的压力下。考虑到机械测试和微观结构观察的结果,对于声音键,在10MPa下在温度850℃下获得最佳粘合条件60分钟。基于这些研究,将流程图用于制造可调谐盘。

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