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Capacitive Single Crystal Silicon Touch-Mode Pressure Sensor

机译:电容式单晶硅触控模式压力传感器

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A capacitive, touch-mode pressure sensor has been developed. The sensor element is formed entirely from single crystal silicon, giving it good linearity with exceptional stability over time, temperature and pressure cycles. The sensor is produced using a low-cost, high volume fabrication process. The sensor diaphragm deflects in proportion to absolute pressure, resulting in a quasi-linear change in capacitance between the diaphragm and the substrate. The key to the linearity of this device is the touch-mode operation, in which the diaphragm makes physical contact with the oxide on the substrate during normal operation. The device is suited for both wire-bonded and flip-chip applications. The sensor is designed to measure pressures from 100 to 800 kPa absolute over a -40°C to 125°C temperature range. Typical device sensitivity in this range is 0.05pF/kPa +/-3%. Temperature Coefficient of Offset(TCO) over the full temperature range is less than 120ppm/°C and a Temperature Coefficient of Sensitivity(TCS) less than 200ppm/°C. Finite Element Analysis (FEA) modeling and actual characterization results have shown that other ranges and sensitivities may be obtained with simple changes to the device geometry.
机译:已经开发了一种电容式触控压力传感器。传感器元件完全由单晶硅形成,使其具有卓越的稳定性随时间,温度和压力循环。传感器采用低成本,大容量制造工艺生产。传感器隔膜与绝对压力成比例地偏转,导致隔膜和基板之间的电容的准线性变化。该装置的线性度的关键是触摸模式操作,其中隔膜在正常操作期间与衬底上的氧化物物理接触。该装置适用于引线粘合和倒装芯片应用。传感器设计用于测量100至800kPa绝对值的压力,在-40°C至125°C温度范围内。该范围内的典型设备敏感性为0.05pf / kpa +/- 3%。全温度范围内的偏移量(TCO)的温度系数小于120ppm /°C,温度系数敏感度(Tcs)小于200ppm /°C。有限元分析(FEA)建模和实际表征结果表明,可以通过简单地改变设备几何体来获得其他范围和敏感性。

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