Surface Activated Bonding for Copper Plate by Excimer Laser Irradiation

摘要

When a pair of clean solid surface are brought close to the atoms distance in the vacuum, the solids were bonded by the gravitation and binding force. Such a way of bonding is called a surface activated bonding. In this work, a laser irradiated to a couple of copper plates surface under various conditions of laser irradiation. The surface oxidation layer and organic layer were removed by laser ablation. After the irradiation, a couple of copper plates surface get close to each other. The possibility of the bonding was examined by AFM.