Vibration Testing as a Tool to Optimize the Configuration of the PCBs

摘要

This paper is linked to the EU project Euripides Eureka BOB (Board on Board) which is a joint solution for companies from four European countries. Its goal is the development, design, implementation and validation of an innovative configuration of the PCBs in 2.5D arrangement, which is designed for applications with a high density of components, and must meet the requirements for reliability in harsh environment and the ability to repair. To minimize the effect of mechanical stress is one of the priorities of this new construction, where a high density of components occurs on both sides of the PCB configuration. Therefore, any new solution, especially in 2.5D configuration, designed for harsh environment, requires mechanical stress optimization, already in the board's design process. Shock and vibration tests are also essential steps to reliability and quality assurance. This paper suggests as a simple example of one possible way to achieve this goal using vibration testing, including vibration simulations in ANSYS, to optimize the layout during the PCB design process. The optimization process consists of a sequence of necessary steps that need to be performed. The main contribution of this work is to show the first approach in the simulation of vibrations, and demonstrate that this path can help you choose the best design and layout of PCB, so as to avoid later problems caused by mechanical influences. In summary, specific rules are provided for verification of mechanical reliability by vibration testing and the most important properties of PCBs are defined. This procedure is in general suitable for use primarily in the design of any PCB, where you can prevent possible complications due to the impact of mechanical stress on the reliability of newly developed products.