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Interaction of the Mode III Interface Crack with a Thin Stiff Nonideal Interface

机译:用薄僵硬的非积极界面的模式III界面裂缝的交互

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Asymptotic behaviour of the elastic solution in a vicinity of the interface crack tip lying at a nonideal interface is investigated. The interface is assumed to be essentially stiffer in comparison with the bonded elastic materials. Additionally, inhomogeneity of the interface material is taken into account. The simplest case of the Mode III deformation is under consideration. It is shown that the main terms of asymptotic behaviour are practically similar to those in the case of the ideal interface (but with different SIFs in each materials). Moreover, for some special loading there is no difference between the models at all. However, in a general case, additional singular terms of stresses can appear for the stiff nonideal interface model.
机译:研究了在界面裂纹尖端附近的弹性溶液的渐近行为进行了位于非膜界面的界面裂缝尖端附近。与粘合的弹性材料相比,假设界面基本上更硬。另外,考虑了界面材料的不均匀性。正在考虑最简单的模式III变形的情况。结果表明,渐近行为的主要术语实际上与理想界面的情况(但是在每种材料中的不同SIF)类似)。此外,对于一些特殊装载,模型根本没有区别。然而,在一般情况下,对于僵硬的非积极界面模型,可以出现额外的单个应力。

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