Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics

摘要

Manifold fluid flow networks are an essential element in cooling systems that distribute forced air or forced liquid cooling to high performance modular electronics. Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar with the basic fluid dynamics concepts that govern flow rate and pressure distribution in manifold systems. The subject paper describes a one dimensional discrete branch point model for manifold analysis. Predicted results are compared with liquid flow test data in the laminar and transitional regimes. CFD simulations are used to assess the validity of selected empirical coefficients. Basic design guidelines for the practicing engineer are provided.