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Influence of a Single Temperature Cycle on Crack Propagation in a Thin Plate With a Cold Expanded Hole

机译:单温循环对具有冷膨胀孔薄板裂纹传播的影响

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A closed form solution technique is developed for predicting residual stresses after cold-expansion of a circular hole and a subsequent temperature cycle. It is assumed that the material obeys Mises' yield criterion and its associated flow rule. It is shown that the solution is very sensitive to small changes in temperature. A simple equation is derived to illustrate the variation of residual hoop stress at the edge of the hole with the amplitude of the temperature cycle. In particular, this equation shows that this stress becomes positive after temperature cycles of a small amplitude. Therefore, cracks that were stable due to residual hoop comprehensive stresses caused by cold-expansion can propagate during or after the temperature cycle.
机译:开发了一种封闭的形式解决方案技术,用于预测圆孔冷膨胀和随后的温度循环后的残余应力。假设材料遵循误区的屈服标准及其相关的流量规则。结果表明,该溶液对温度的小变化非常敏感。导出简单方程以说明具有温度循环幅度的孔边缘处的残余箍应力的变化。特别地,该等式表明,在小幅度的温度循环之后,这种应力变为正。因此,由于冷膨胀引起的残余箍综合应力稳定的裂缝可以在温度循环期间或之后传播。

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