Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts

摘要

We developed self extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). The new epoxy-resin compounds mainly consisting of phenol-aralkyl-type epoxy resins and hardeners, form ed stable foam layers that retard heat transfer, thus self extinguished. Especially beneficial is the fact that the IC molding compound based on the new compounds, can withstand the higher temperature required for lead-free soldering. The PWB, which besides the compounds also contains a limited amount of safe metal hydroxide, exhibits good practicality.