首页> 外文会议>Annual International Conference on Micro Electro Mechanical Systems >Novel shear strength evaluation of MEMS materials using asymmetrical four-point bending technique
【24h】

Novel shear strength evaluation of MEMS materials using asymmetrical four-point bending technique

机译:使用不对称四点弯曲技术的MEMS材料的新型剪切强度评价

获取原文

摘要

This paper describes a novel shear testing technique for MEMS materials based on an Asymmetrical Four-Point Bending (AFPB) method [1]. This research has newly developed a shear tester and a AFPB test specimen that are able to apply simple shear stress loading to a micro single crystal silicon (SCS) specimen with “U” shaped notches (U-notches), in order to estimate shear strength and to observed fracture behavior for the SCS specimens under shear stressing. Consequently, we have, for the first time, succeeded in evaluating the shear strength and shear strain of SCS on a microscale. Averaged shear modulus of SCS was obtained 53.7 GPa in [112] direction on (110) plane, which was close to theoretical value. The shear strength of SCS ranged from 1.0 to 1.3 GPa. The fracture behavior under the shear stressing was observed. The crack initiated on the slip plane at the bottom of U-notches, whereas it propagated perpendicularly to the maximum principal stress direction predicted by FEM.
机译:本文介绍了基于非对称四点弯曲(AFPB)方法的MEMS材料的新型剪切测试技术[1]。该研究新开发了一种剪切测试仪和AFPB测试样本,可以将简单的剪切应力加载到微晶硅(SCS)样本与“U”形的凹口(U-NOTCHES)施加,以估计剪切强度并观察剪切应力下SCS样本的断裂行为。因此,我们第一次成功地评估了微尺度上的SCS的剪切强度和剪切应变。在(110)平面上获得53.7GPa的平均剪切模量53.7GPa,其接近理论值。 SC的剪切强度范围为1.0至1.3 GPA。观察到剪切应力下的断裂行为。在U形凹口的底部的滑动平面上引发的裂缝,而垂直于由FEM预测的最大主应力方向垂直传播。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号