There are so various wireless applications in our general life. One of the most important features is a mobility of wireless device since most people want to transmit and receive all kinds of information anytime and anywhere. Therefore, the size and weight reduction is a main issue in the development of RF system. In many miniaturizing and packaging technologies, multilayer low-temperature co-fired ceramic (LTCC) technology is a promising solution for RF wireless applications. The LTCC technology is suitable for integrating more functions in smaller packages that cost less than the ones currently being used [1]-[4]. One of the main passive components in RF system is filter, which plays an important role in making the performance of total system much better. So, it is important to embed the filter in the substrate. Additionally, in this Bluetooth system, there is one balun which forms a good transition from an unbalanced transmission line into a balanced transmission line. So for the purpose of making a good balance signal, we bury the transmission line balun into LTCC substrate. In this paper, we present the research for implementation of a very compact Bluetooth system based on LTCC system-on-package (SoP) technology. By embedding one BPF, one balun, 4 capacitors, and 2 inductors in LTCC substrate, the proposed module features a compact size of 5.9 mm × 5.05 mm, with a packaged height of 1.3 mm which is about 30% smaller compared to the module based on PCB.
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