Laser-Based Cleaning Processes for Solvent Replacement

摘要

In the past, precision cleaning of materials in aerospace and electronics manufacturing has involved the use of harsh solvents and chemicals that were detrimental to the environment and/or hazardous to workers performing cleaning operations. As these cleaning agents are being phased out, research and development of alternative cleaning technologies is being intensified. This paper reviews the current status of high-power laser-based cleaning approaches to precision cleaning operations and other niche cleaning applications. Laser cleaning of surfaces can be performed without any cleaning agent or secondary waste stream and is applicable to a wide range of contaminant types and substrate materials. Typical applications under investigation include, removal of particles from semiconductor wafers, removal of oil films from metals, debonding of cured adhesives, decontamination of radioactive surfaces, and removal of paint coatings. This paper presents information on the types of lasers used in laser cleaning, postulated laser interaction mechanisms with substrate materials, and laser beam parameters required for cleaning.