首页> 外文会议>International Power Modulator Symposium >Modeling RF Signal Propagation Along On-Chip Interconnects and the Effect of Substrate Doping with the Alternating-Direction-Implicit Finite-Difference Time-Domain (ADI-FDTD) Method
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Modeling RF Signal Propagation Along On-Chip Interconnects and the Effect of Substrate Doping with the Alternating-Direction-Implicit Finite-Difference Time-Domain (ADI-FDTD) Method

机译:沿片上互连的RF信号传播和基板掺杂与交替方向隐式有限差分时间域(ADI-FDTD)方法的效果

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The Alternating-Direction-Implicit Finite-Difference Time-Domain (ADI-FDTD) method is used to analyze Metal-Insulator-Semiconductor-Metal interconnects by solving Maxwell's equations in the time domain. This analysis shows that the silicon substrate losses and the metal line losses can be modeled with high resolution. Our modeling method is supported by experimental data. We find that semiconductors readily operate in the slow wave mode and skin-effect mode for selected doping densities. The ADI-FDTD method is also applied to study the effect of epitaxial layers in different propagating modes. Simulation indicates that inserting epitaxial layers in highly doped substrates should help to keep the signal integrities and reduce substrate noise.
机译:交替方向隐式有限差分时间域(ADI-FDTD)方法用于通过在时域中求解Maxwell的方程来分析金属绝缘体 - 半导体 - 金属互连。该分析表明,硅基衬底损耗和金属线损耗可以以高分辨率建模。我们的建模方法由实验数据支持。我们发现半导体在慢波模式和皮肤效应模式下易于操作,以获得所选择的掺杂密度。 ADI-FDTD方法还应用于研究外延层在不同传播模式中的效果。模拟表明,在高掺杂的基板中插入外延层应该有助于保持信号的完整性并降低基板噪声。

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