MIMIC technology transportability

摘要

A primary goal of the Defense Advanced Research Projects Agency's (DARPA) microwave and millimeter-wave monolithic integrated circuit (MIMIC) program is the demonstration of process-tolerant designs that can be fabricated in multiple facilities at affordable cost. A Hughes/General Electric team's experience with transporting the design and process for a C-band 3-W, two-stage amplifier is described. This amplifier, based on a mature GE design, is now being produced by the five team foundries (Hughes, GE, AT&T, Harris Microwave Semiconductor, and M/A-COM). Problem areas and their solutions are highlighted. The authors detail the cooperative exchange of technology which has enabled transport of this C-band MIMIC and describe the fabrication status, examine process variations, and compare data obtained.