Maruzen Resin M (poly p-vinyl phenol) and Maruzen Resin MB (brominated poly p-vinyl phenol) are new materials developed recently. They are easily cured with epoxy resins without generating volatiles, and yield crosslinked products possessing superior performances for insulation. Epoxy-cured Resin M is suitable for FRP, especially for high grade printed circuit board because of its excellent thermal stabilities (solder resistance, flexural strength, peel strength and electric prperties under high temperature), drilling performances and chemical resistances. The thermal properties are comparable to those of polyimide, and processing conditions are similar to conventional heat-stable epoxy resins. Flame retardant type composite can be obtained by using Resin MB, with little affection to the improved properties above-mentioned. Epoxy-cured Resins M and MB also give electric insulators and structural materials keeping superior thermal and electric performances by molding or casting. Furthermore, the resins are expected to be useful for widespread applications such as adhesives, coatings etc., where high heat-resistance is required.
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