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Design oriented analysis of package power distribution systemconsidering target impedance for high performance microprocessors

机译:面向设计的包装配电系统分析考虑高性能微处理器的目标阻抗

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摘要

This paper presents an efficient design methodology to realize theoutput impedance at the high performance microprocessor core equal to orless than the target impedance to reduce the mid-frequency core noise.Based on the frequency domain analysis of the lumped model of thepackage power distribution network (PPDN), a systematic method ofestimating capacitance and associated parasitics of decouplingcapacitors used in the distributed model of the PPDN is described. Thesimulation results of the analytical method show good correlation withthe SPICE simulation results of the distributed PPDN model to reduce theoutput impedance at the core
机译:本文提出了一种有效的设计方法来实现 高性能微处理器内核上的输出阻抗等于或 小于目标阻抗,以降低中频核心噪声。 基于频域分析的集总模型 封装配电网(PPDN),一种系统的方法 估算去耦电容和相关寄生效应 描述了在PPDN的分布式模型中使用的电容器。这 该分析方法的仿真结果与 分布式PPDN模型的SPICE仿真结果可减少 核心输出阻抗

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