The authors present SETIPIC, a software to simulate theelectrothermal interactions in the first design steps of powerintegrated circuits. To give a well-consistent interface to thedesigner, SETIPIC has been integrated in the EDGE CAD system. Thesoftware aspect of this integration is explained. SETIPIC works aroundSPICE3 (electric simulation) and PICMOST (thermal simulation). Thisthermal simulator which calculates the thermal distribution on thelayout surface of a chip taken in its environment is also described.Finally, an infrared experimental set up is proposed to validate SETIPICand some thermal and electrothermal simulation results are given
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