首页> 外文会议>Electronics and the Environment, 1996. ISEE-1996., Proceedings of the 1996 IEEE International Symposium on >Elimination of CFC's and the chemical waste with the use ofno-clean solder in RF power module
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Elimination of CFC's and the chemical waste with the use ofno-clean solder in RF power module

机译:使用以下产品消除CFC和化学废物射频功率模块中的免清洗焊料

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The pursue of CFC use elimination in many industries has opened upan opportunity for the development of substitutes for CFCs. No cleansolder is just one of the many examples developed in response this need.Besides the elimination of CFCs, this project was also set up toeliminate chemical waste disposal problems with such materials asTerpene, Ionox, flux residue etc. Through the ability of implementingthe no clean solder, the authors have been able to eliminate thesechemical wastes hence reducing the current existing problem. This reportdescribes materials selection, method of paste application and the renewprofile essential for achieving the no-clean process
机译:在许多行业中消除对氟氯化碳使用的追求已经开始 开发氟氯化碳替代品的机会。不干净 焊料只是为满足这种需求而开发的众多示例之一。 除了消除氟氯化碳外,该项目还设立了 消除使用以下材料处理化学废物的问题: 萜烯,Ionox,助焊剂残渣等。通过实施的能力 没有干净的焊料,作者已经能够消除这些 化学废物因此减少了当前存在的问题。这份报告 描述材料选择,粘贴方法和更新 轮廓对于实现免清洗过程至关重要

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