Elimination of Freon and methylchloroform from the manufacturingprocess for hybrid microelectronic circuits

摘要

Recognizing the harmful effects of Freon and methylchloroformsolvents on the environment, Westinghouse embarked on an extensiveelimination/reduction program in connection with the manufacturing ofhybrid microelectronic circuits. Experiments were performed in thefollowing five key areas: thick film substrate fabrication, componentattachment, substrate mounting, wirebonding, and package sealing. Ineach area, it was possible to eliminate or to find a suitablealternative to Freon and methylchloroform. The following recommendationsare made: (1) Rosstech 119ME should be used for wet and dry thick filmpaste removal; (2) PF degreaser, acetone, and isopropyl alcohol shouldbe used for removal of leak test grease: and (3) isopropyl alcoholand/or plasma cleaning should be used for all other cleaning operations