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CLRFrame: An Analysis Framework for Designing Cross-Layer Reliability in Embedded Systems

机译:CLRFrame:用于设计嵌入式系统中跨层可靠性的分析框架

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Continued transistor scaling and increasing power density have led to considerable increase in fault rates in silicon nanotechnology-based real-time systems. Instead of fixing everything at the hardware layer, cross-layer fault tolerance techniques present a more cost-efficient methodology for adapting to such increased fault rates. The effectiveness (Coverage, Fault-Masking, and Recovery) and overheads (Execution time, Energy and Cost) of each fault-tolerance technique vary with the layer and the frequency at which it is implemented. Therefore, appropriate modeling of fault-mitigation methods is necessary for efficient cross-layer design space exploration (DSE). To this end, we propose a first-order framework for analyzing the effects of implementing fault-tolerance across multiple layers. We also propose a Markov-chain based methodology for analytical modeling of fault-mitigation methods and their interlayer interaction. As a case-study, we model some generic fault-mitigation methods and provide detailed modeling of typical application execution involving fault-mitigation at different layers.
机译:持续的晶体管缩放和不断增加的功率密度已导致基于硅纳米技术的实时系统的故障率显着提高。跨层容错技术不是将所有内容都固定在硬件层,而是提供了一种更具成本效益的方法来适应这种增加的故障率。每种容错技术的有效性(覆盖率,掩膜和恢复)和开销(执行时间,能源和成本)随层和实施频率的不同而不同。因此,对于有效的跨层设计空间探索(DSE),必须采用适当的故障缓解方法模型。为此,我们提出了一个用于分析实现多层容错效果的一阶框架。我们还提出了一种基于马尔可夫链的方法,用于故障缓解方法及其层间相互作用的分析建模。作为案例研究,我们对一些通用的故障缓解方法进行了建模,并提供了涉及不同层的故障缓解的典型应用程序执行的详细建模。

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